|
|
|
Cure Monitoring for Composites and Adhesives
Product Code: 978-1-85957-393-8
You are in: New Releases
> Publications > Cure Monitoring for Composites and Adhesives
|
|
Cure Monitoring for Composites and Adhesives
Rapra Review Report
Vol. 14, No. 8, Report 164, 2003
By David Mulligan, National Physical Laboratory
Composite manufacturing methods vary from labour intensive techniques such as hand lay-up to capital intensive techniques such as autoclaving. The basic curing process is the same in each case: the liquid resin first gels and then becomes a glassy solid. If the curing process carries on for too long, degradation of the material can occur. On the other hand, if it does not proceed for long enough or at too low a temperature, insufficient curing takes place and the material properties are inadequate.
Contents
1 Introduction
1.1 Aims and Scope
1.2 Cure of Composites and Adhesives
1.3 Benefits of Cure Monitoring
2 Techniques Monitoring Thermal Properties
2.1 Temperature
2.2 Thermal Conductivity
3 Techniques Monitoring Mechanical Properties
3.1 Ultrasonic
3.2 Acoustic
3.3 Fibre Optic
3.3.1 Extrinsic Fabry-Pérot Sensor
3.3.2 Fibre Bragg Grating Sensor
3.4 Piezoelectric
4 Techniques Monitoring Electrical Properties
4.1 Electrical Techniques
4.2 Dielectric Sensors
4.3 Interpretation of Dielectric Data
5 Techniques Monitoring Optical Properties
5.1 Refractive Index
5.2 Spectroscopic
5.2.1 Infrared Spectroscopy
5.2.2 Fluorescence
5.2.3 Raman Spectroscopy
5.2.4 Comparison of Optical Sensors
6 Implementation of Cure Monitoring
6.1 Process Modelling and Control
6.2 Off-line Cure Assessment
6.2.1 Physical Property Measurements
6.2.2 Chemical Property Measurements
6.2.3 Comparison of Off-line Techniques
6.3 Quality Assurance
6.4 Comparison of Techniques
6.4.1 Technical Considerations
6.4.2 Practical Considerations
7 The Way Ahead for Cure Monitoring
Additional References
Price: £85.00 (Ex VAT)
|
|
|
|
|
|
| Product Reviews |
|
No one has left a review for this product yet.
Be the first to do so by clicking here.
|
|
|
|
|
